"Advancing Semiconductor Design, Assembly, Testing and Packaging in Southeast Asia"
1st Call for Papers
A premier academic-industry convergence on semiconductor innovation
The Research Conclave, organized by the Department of Electronics and Communication Engineering, Assam Don Bosco University, in collaboration with the Center for Reliability Science and Technology (CReST), Chang Gung University, Taiwan, and the Department of Electronics and Communication Engineering, Gauhati University, aims to bring together researchers, industry experts, academicians, policymakers, and students to discuss recent advancements in semiconductor design, assembly, testing, and packaging in Southeast Asia.
It seeks to promote innovation, strengthen academic-industry partnerships, encourage collaborative research, and develop skilled talent to support the rapidly growing semiconductor ecosystem in the region.
Driving breakthroughs in semiconductor technologies
Strengthening academia-industry collaboration
Fostering cross-border research initiatives
Building skilled workforce for the semiconductor ecosystem
Distinguished experts from across the globe
William E. Leonhard Professor & Department Head of Electrical Engineering
The Pennsylvania State University, USA
Professor & Chair
Indian Institute of Science
School of Electronics Engineering; CReST
Chang Gung University, Taiwan
Professor
Universiti Sains Malaysia, Malaysia
Professor
Indian Institute of Technology Guwahati
Professor
Assam Skill University
Vice President
Assam down town University
Marketing Manager
Moxa, Taiwan
Vice President
Infineon Technologies, Taiwan
Associate Provost
Singapore University of Technology and Design
Vice President & GM, Empyrean Korea
Empyrean Technology
Counsellor & Director, Science and Technology Division
Taipei Economic and Cultural Center in India
Head, Regional Strategy & Ecosystem Development
Tata Electronics
Professor
Assam Engineering College
Professor
North Eastern Regional Institute of Science and Technology
Key topics, submission guidelines, and event highlights
• Researchers, academicians, and industry professionals are invited to submit papers.
• Topics aligned with semiconductor design, packaging, testing, and emerging technologies.
• Interdisciplinary and industry-focused papers are highly encouraged.
• Selected papers will be presented during technical sessions.
Format: 8–10 pages (PDF)
Industry leaders and renowned experts sharing their insights, experiences, and vision for the future of semiconductor technologies.
Paper presentations by researchers and scholars, encouraging knowledge exchange and academic discussions.
Interactive sessions with academicians, industry professionals, and policymakers addressing current challenges and opportunities.
Opportunities to connect with peers, researchers, and industry experts to build collaborations and professional networks.
| Milestone | Date |
|---|---|
| Paper Submission Deadline | 10 July 2026 |
| Notification of Acceptance | 30th July 2026 |
| Presentation Dates | 25–27 September 2026 |
Secure your spot at Research Conclave 2026
| Category | Early Bird | Regular |
|---|---|---|
| Student / Research Scholar | ₹3,000 | ₹3,500 |
| Faculty | ₹5,000 | ₹6,000 |
| Industry Professional | ₹8,000 | ₹10,000 |
| International Delegate | $200 | $250 |
Industry partners and sponsors will be announced soon. Stay tuned for updates!
Join us at Assam Don Bosco University
Azara Campus, Guwahati, Assam – 781017, India
For queries related to registration, papers, or travel assistance
Department of Electronics and Communication Engineering
Assam Don Bosco
University, Azara Campus, Guwahati, Assam, India